JPH0180952U - - Google Patents
Info
- Publication number
- JPH0180952U JPH0180952U JP1987176663U JP17666387U JPH0180952U JP H0180952 U JPH0180952 U JP H0180952U JP 1987176663 U JP1987176663 U JP 1987176663U JP 17666387 U JP17666387 U JP 17666387U JP H0180952 U JPH0180952 U JP H0180952U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- tie bar
- inner leads
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987176663U JPH0180952U (en]) | 1987-11-19 | 1987-11-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987176663U JPH0180952U (en]) | 1987-11-19 | 1987-11-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0180952U true JPH0180952U (en]) | 1989-05-30 |
Family
ID=31468383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987176663U Pending JPH0180952U (en]) | 1987-11-19 | 1987-11-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0180952U (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021533574A (ja) * | 2018-09-25 | 2021-12-02 | ▲蘇▼州▲ユン▼冢▲電▼子科技股▲フン▼有限公司 | 電気素子を有するベース及びボイスコイルモータ |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5367356A (en) * | 1976-11-27 | 1978-06-15 | Nec Corp | Lead protection method for semiconductor device |
JPS5578558A (en) * | 1978-12-08 | 1980-06-13 | Nec Corp | Manufacture of semiconductor integrated circuit |
JPS58161349A (ja) * | 1982-03-19 | 1983-09-24 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPS5933852A (ja) * | 1982-08-19 | 1984-02-23 | Toshiba Corp | 半導体装置の製造方法 |
-
1987
- 1987-11-19 JP JP1987176663U patent/JPH0180952U/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5367356A (en) * | 1976-11-27 | 1978-06-15 | Nec Corp | Lead protection method for semiconductor device |
JPS5578558A (en) * | 1978-12-08 | 1980-06-13 | Nec Corp | Manufacture of semiconductor integrated circuit |
JPS58161349A (ja) * | 1982-03-19 | 1983-09-24 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPS5933852A (ja) * | 1982-08-19 | 1984-02-23 | Toshiba Corp | 半導体装置の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021533574A (ja) * | 2018-09-25 | 2021-12-02 | ▲蘇▼州▲ユン▼冢▲電▼子科技股▲フン▼有限公司 | 電気素子を有するベース及びボイスコイルモータ |